Home NewsStock Market News Samsung considers increasing investment in semiconductor packaging to expand production capacity in South Korea | Anue Juheng – Taiwan Stock News

Samsung considers increasing investment in semiconductor packaging to expand production capacity in South Korea | Anue Juheng – Taiwan Stock News

by WOOWinvest
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Samsung considers increasing investment in semiconductor packaging to expand production capacity in South Korea | Anue Juheng – Taiwan Stock News


According to South Korean media reports, Samsung Electronics has begun to consider increasing investment in the semiconductor packaging business, and is evaluating an investment plan that may expand production at the Cheonan plant in South Korea; At the limit, the demand for advanced packaging has also increased simultaneously. Samsung Electronics intends to use this to strengthen its competitiveness in the field of wafer foundry and compete with TSMC (2330-TW) (TSM-US).

Samsung has been actively deploying the semiconductor packaging business recently. In mid-June, the DS department responsible for the foundry business established a semiconductor packaging task force (TF), directly under the DS department executive Kyung Kye-hyun, to strengthen Samsung and large-scale companies. The cooperation of foundry customers in the packaging field; Samsung has also increased the number of packaging teams, and the target number will be increased from the current 150 to more than 300 in 2024.

Samsung Electronics’ current semiconductor packaging capacity is mainly located in Onyang and Cheonan, Chungcheongnam-do, South Korea. It also has a semiconductor packaging factory and R&D center in Suzhou, China. South Korean media reports pointed out that Samsung may be renting space at the Cheonan factory of Samsung Display, a subsidiary of the group, to expand production.

Samsung originally reported in January this year that it plans to invest about 200 billion won in the Cheonan Semiconductor fab to establish an advanced packaging wafer-level fan-type packaging (FOWLP) production line and use it for the production of its Exynos series mobile processors, but plans It was questioned by its own executives, who believed that the company did not have reliable customers and could not ensure demand, so the plan faced re-evaluation.

According to the research of Yole Development, a market research company, Intel (INTC-US) and TSMC ranked first and runner-up in the global semiconductor advanced packaging investment this year, accounting for 32% and 27% respectively, followed by ASE (3711-TW) ( ASX-US), Samsung is fourth.

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